In the silver plating of copper, K[AG(CN)2] is used instead of AgNO3. The reason is :-

Question

In the silver plating of copper, K[AG(CN)2] is used instead of AgNO3. The reason is :- (A) a thin layer of Ag is formed on Cu (B) more voltage is required (C) Ag+ ions are completely removed from solution (D) less availability of Ag+ ions, as Cu cannot displace Ag from [Ag(CN)2]- ion

Tardigrade Admin · Accepted Answer

In the silver plating of copper, K[Ag(CN)2] is used instead of AgNO3. The reason is less availability of Ag+ ions, as Cu cannot displace Ag from [Ag(CN)2]- ion.

Q. In the silver plating of copper, $K [A G (CN)_{2}]$ is used instead of $A g N O_{3} .$ The reason is :-

a thin layer of Ag is formed on Cu

more voltage is required

$A g^{+}$ ions are completely removed from solution

less availability of $A g^{+}$ ions, as Cu cannot displace Ag from $[A g (CN)_{2}]^{-}$ ion

In the silver plating of copper, $K [A g (CN)_{2}] i s$ used instead of $A g N O_{3} .$ The reason is less availability of $A g^{+}$ ions, as Cu cannot displace Ag from $[A g (CN)_{2}]^{-}$ ion.

Q. In the silver plating of copper, K[AG(CN)2​] is used instead of AgNO3​. The reason is :-

a thin layer of Ag is formed on Cu

more voltage is required

Ag+ ions are completely removed from solution

less availability of Ag+ ions, as Cu cannot displace Ag from [Ag(CN)2​]− ion

In the silver plating of copper, K[Ag(CN)2​]is used instead of AgNO3​. The reason is less availability of Ag+ ions, as Cu cannot displace Ag from [Ag(CN)2​]− ion.

Q. In the silver plating of copper, $K [A G (CN)_{2}]$ is used instead of $A g N O_{3} .$ The reason is :-

$A g^{+}$ ions are completely removed from solution

less availability of $A g^{+}$ ions, as Cu cannot displace Ag from $[A g (CN)_{2}]^{-}$ ion

In the silver plating of copper, $K [A g (CN)_{2}] i s$ used instead of $A g N O_{3} .$ The reason is less availability of $A g^{+}$ ions, as Cu cannot displace Ag from $[A g (CN)_{2}]^{-}$ ion.