Thank you for reporting, we will resolve it shortly
Q.
Which of the following is not a process involved in fabrication of $IC$ ?
AFMCAFMC 2006
Solution:
The different processes involved in the fabrication of an $IC$ are:
(i) Epitaxial growth of $n$ or p-type layer, whenever desired. This involves cracking of silane.
(ii) Oxidation which gives a layer of insulating $SiO _{2}$ and can be used to separate one region of the silicon chip from the other.
(iii) Photolithography is a process in which different regions of silicon chip are photographically selected and etched so that different components can be fabricated in different regions.
(iv) Diffusion of different impurities to obtain different device structure.
(v) Metallisation involves deposition of metal films which interconnect different components on a chip to obtain the circuit.